웨이퍼 표면 온도 실시간 감지, 무선 토탈 시스템 개발
Development of wireless total system for real time detection of wafer surface temperature
- 주제(키워드) 웨이퍼 표면 온도 모니터링
- 발행기관 아주대학교
- 지도교수 이기근
- 발행년도 2020
- 학위수여년월 2020. 2
- 학위명 석사
- 학과 및 전공 IT융합대학원 IT융합공학과
- 실제URI http://www.dcollection.net/handler/ajou/000000029557
- 본문언어 한국어
- 저작권 아주대학교 논문은 저작권에 의해 보호받습니다.
초록/요약
본 연구는 열화상 센서를 이용하여 취득한 적외선 온도 데이터 값으로, 반도체 공정 진행 간 챔버 내부 및 웨이퍼의 표면 온도를 실시간으로 측정하여 사용자가 원하는 공정 결과를 얻을 수 있도록 분석하며, 공정 진행 간 사전에 interlock을 조치하여, 공정 사고를 예방 할 수 있도록, 공정 관리시스템 개발을 목표로 한다. 반도체 공정 진행 결과는 챔버 내부 조건에 따라 많은 변수가 존재한다. 챔버 내부의 배기량, 사용 약액의 토출 양/토출 시간, 공정 진행 레시피 등이 있으며, 위와 같은 조건들로 인하여 공정 결과도 같이 바뀌게 되며 조건들 모두 동일할 경우에는 열화상 센서의 설치 위치, calibration 값 등 센서의 파라미터에 따라 실험과 해석을 바탕으로 연구를 진행하였다. 웨이퍼의 데이터를 측정하는 센서의 설치 거리(100mm ~200mm)에 따른 거리별 온도 변화량에 관여하는 설정 값에 대하여 각각 측정하여 저온부터 고온까지 균일하고 신뢰성 있는 온도를 측정할 수 있도록 데이터 및 이미지 자료를 구축하였으며, 이 연구를 위하여 제작한 공정 챔버를 이용하여 구축한 데이터 및 파라미터를 입력하여 실제로 공정 데이터를 실시간 확인하고, 발생할 수 있는 interlock을 설정하여, 사전에 발생할 수 있는 공정 사고를 예방하는 관리 시스템을 연구하였다.
more목차
1. 연구의 필요성 ······································································································· 1
1.1 연구의 배경 및 목적 ···················································································1
1.2 실시간 웨이퍼 온도 모니터링의 필요성 ·················································1
1.3 기존 장비회사의 접근 방법 ·······································································2
1.4 제안하는 웨이퍼 표면 온도 모니터링 시스템 구성도 ·························2
2. 연구의 구성 ··········································································································· 4
2.1. 적외선 기본 이론 ························································································4
2.2. 유형별 적외선 센서 분류 ········································································6
2.3. 본 연구의 적외선 센서 동작 원리 ··························································7
2.4. 센서 인터페이스 회로 구성 ······································································8
2.5. Sensor -> Amp Can 통신 Data 전송 ···············································9
2.6. Amp -> PC TCP/IP통신 데이터 전송 ·············································10
2.7. 웨이퍼 온도 모니터링 시스템 개발 ·····················································10
3. 실험 환경 구성 및 측정 ··················································································· 11
3.1 챔버 내 센서 설치 ····················································································11
3.2 Black Body에 따른 Sensor Calibration ···········································11
3.3 웨이퍼 JIG 설치 ························································································13
3.4 인터페이스 설치 ························································································15
3.5 데이터 추출 ································································································15
4. 결과 및 분석 ······································································································· 16
4.1 전체 시스템 세부적 구성요소 ································································16
4.2 프로세스에 따른 온도 측정 결과 및 분석 ··········································17
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4.3 거리에 따른 온도 분포(측정결과의 오차 이유) ································18
4.4 Interlock 조절에 따른 온도 변화 측정 ···············································20
4.5 기타 연구 ····································································································21
4.5.1 Sensor Calibration ··········································································21
4.5.2 Black Body ························································································23
4.5.3 반복 측정 결과 ···················································································23
4.5.4 fault를 받은 상황에서의 후속 조치 ··············································24
5. 결론 ······················································································································· 25
참고문헌 ···················································································································· 26
